COPYRIGHT (C) 2021 TESSOLVE SEMICONDUCTOR PVT. LTD., ALL RIGHTS RESERVED
THE INFORMATION CONTAINED HEREIN IS THE EXCLUSIVE PROPERTY OF TESSOLVE SEMICONDUCTOR PVT. LTD.
AND SHALL NOT BE DISTRIBUTED AND SHALL NOT REPRODUCED OR DISCLOSED IN WHOLE OR IN PART WITHOUT 
PRIOR WRITTEN PERMISSION OF TESSOLVE SEMICONDUCTOR PVT. LTD.
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CUSTOMER		-	TI          	
CARD NAME		-	308723-8721-1DU     	
PART NUMBER		-	DLP055C	
DATE                   	-	16-Apr-2021
DESIGNED AT     	-	Tessolve Semiconductor Pvt. Ltd.
CONTACT E-Mail ID	-	engineering_cbe@tessolve.com
GERBER FORMAT 		-	RS274X , ENGLISH  2,5 LEADING
DRILL FORMAT 		-	EXCELLON ENGLISH  2,5 TRAILING
PACKAGE NAME   		-	DLP055C_8721-1DU_FAB.zip

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LIST OF FILES INSIDE PACKAGE:

ELECTRICAL LAYERS :

TOP.art			- Layer 1 TOP LAYER
L02.art			- Layer 2 GND PLANE
L03.art			- Layer 3 SIGNAL
L04.art			- Layer 4 GND PLANE
L05.art			- Layer 5 SIGNAL
L06.art			- Layer 6 GND PLANE
L07.art			- Layer 7 POWER PLANE
L08.art			- Layer 8 POWER PLANE
L09.art			- Layer 9 GND PLANE
L10.art			- Layer 10 SIGNAL
L11.art			- Layer 11 GND PLANE
L12.art			- Layer 12 SIGNAL
L13.art			- Layer 13 GND PLANE
BOT.art		        - Layer 14 BOTTOM LAYER

NON ELECTRICAL LAYERS :

ASSYB.art		- Assembly layer Bottom Side
ASSYT.art		- Assembly layer Top Side
SMT.art			- Solder Mask Top Side 
SMB.art			- Solder Mask Bottom Side 
SST.art			- Silkscreen Top Side
SSB.art			- Silkscreen Bottom Side
SPT.art			- Solder Paste Top Side
SPB.art			- Solder Paste Bottom Side
FAB.art			- Fabrication Drawing

DRILL LAYERS :

PTH.drl			- Plated through holes drill file
NPTH.drl		- Non Plated through holes drill file
PTH_ROUTE.rou		- Plated through holes route file
NPTH_ROUTE.rou		- Non Plated through holes route file

OTHER FILES :

IPC356A.ipc		- IPC-D-356 Netlist 
All Layers.pdf		- PDF Plots of all layers
Readme_Fab.txt		- This file
